COOLING STRUCTURE AND COOLING APPARATUS

• Main Authors: ISHIMURA KOJI, YAMAGUCHI TAKESHI, KANEDA IICHIRO
• Format: Patent
• Language: English
• Published: 08.02.2007
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a cooling apparatus in which the number of parts is reduced and a cooling effect is high as a cooling structure and a cooling apparatus for an inverter device used in a motor for a hybrid automobile or an electric automobile. SOLUTION: This cooling apparatus comprises a heat sink comprising a high thermal conductive material in which a cooling fin is disposed on one surface of the heat sink and a power semiconductor element having a small heat resistance and a small heat capacity is connected to another surface of the heat sink than the surface on which the cooling fin is disposed, through a high thermal conductive material, so that by the cooling apparatus, an insulating type package power semiconductor element is cooled by letting a cooling water flow through the heat sink with the cooling fin. COPYRIGHT: (C)2007,JPO&INPIT