MULTI-PATTERN WIRING BOARD

PROBLEM TO BE SOLVED: To provide a multi-pattern wiring board which is improved in the accuracy of the formation position and the depth of splitting grooves. SOLUTION: Division grooves 110 are formed in a motherboard 101 at interfaces 109 between a plurality of wiring board regions 102, and openings...

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Bibliographic Details
Main Author ONIZUKA YOSHITOMO
Format Patent
LanguageEnglish
Published 08.02.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a multi-pattern wiring board which is improved in the accuracy of the formation position and the depth of splitting grooves. SOLUTION: Division grooves 110 are formed in a motherboard 101 at interfaces 109 between a plurality of wiring board regions 102, and openings 104 are provided in margin areas 103 on the extensions of the interface 109 between the plurality of wiring board regions 102. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050218528