POLISHING PAD

PROBLEM TO BE SOLVED: To provide a polishing pad for endpoint detection capable of improving accuracy for a polishing process and using for giving useful information. SOLUTION: The polishing pad 18 has a hole 30 which is disposed in a first layer 22 made of polyurethane material and in the rear surf...

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Bibliographic Details
Main Authors GLEASON ALLAN, PYATIGORSKY GRIGORY, BIRANG MANOOCHER, JOHANSSON NILS
Format Patent
LanguageEnglish
Published 01.02.2007
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PERFORMING OPERATIONS
PHYSICS
POLISHING
SEMICONDUCTOR DEVICES
TESTING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a polishing pad for endpoint detection capable of improving accuracy for a polishing process and using for giving useful information. SOLUTION: The polishing pad 18 has a hole 30 which is disposed in a first layer 22 made of polyurethane material and in the rear surface, and formed in a polishing surface consisting of a second layer material 20 softer than the first layer material, a transparent solid portion comprising a quartz insert inserted to the hole, and a groove which is formed on the surface opposite to the polishing surface, aligned with the transparent solid portion, and extends to the transparent solid portion. The polishing pad is used for measuring uniformity in a layer on a substrate during polishing a concerning layer in situ. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20060248420