IC MODULE STRUCTURE OF IC CARD OR TAG WITH CONTACT TERMINAL

PROBLEM TO BE SOLVED: To provide the IC module structure of an IC card or a tag with a contact terminal, which can resist bending shock or stress from the contact terminal side even in the case of a thin type IC card or a tag. SOLUTION: In the IC module structure of the IC card or the tag with the c...

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Bibliographic Details
Main Authors SATO TAKASHI, AKAGI KAZUYOSHI, SETO KAZUHIRO
Format Patent
LanguageEnglish
Published 11.01.2007
Subjects
BASIC ELECTRIC ELEMENTS
BOOK COVERS
BOOKBINDING
CALCULATING
COMPUTING
COUNTING
DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILES
HANDLING RECORD CARRIERS
LOOSE LEAVES
MOVABLE-STRIP WRITING OR READING APPARATUS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES
PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
SPECIAL PRINTED MATTER
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide the IC module structure of an IC card or a tag with a contact terminal, which can resist bending shock or stress from the contact terminal side even in the case of a thin type IC card or a tag. SOLUTION: In the IC module structure of the IC card or the tag with the contact terminal, which is constituted of an IC chip 3 and the contact terminal 2; the IC chip 3 is mounted on the contact terminal 2 through a reinforcing plate 6 constituted of stainless steel with 0.01-0.1mm thickness, having an area not less than the contact area of the IC chip 3 and having an insulating adhesive resin 7 on both the surfaces on the mounting side of the IC chip 3 on the contact terminal 2. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050183521