RESIN MOLDED PRODUCT
PROBLEM TO BE SOLVED: To provide a resin molded product equipped with an attaching seat enhanced in rigidity though lightweight and capable of effectively absorbing the impact load applied to the attaching seat. SOLUTION: A skin layer 23 is formed to the surface of a panel main body 3 excepting the...
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Main Author | |
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Format | Patent |
Language | English |
Published |
11.01.2007
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a resin molded product equipped with an attaching seat enhanced in rigidity though lightweight and capable of effectively absorbing the impact load applied to the attaching seat. SOLUTION: A skin layer 23 is formed to the surface of a panel main body 3 excepting the attaching seat 7 and an attaching seat outer peripheral vicinal part 19, and an expanded layer 25 having a large number of voids is formed in the skin layer 23. A solid layer 27 having no expanded layer 25 is formed to the attaching seat 7 and the attaching seat outer peripheral vicinal part 19. The relation between the panel thickness T1 of the panel main body 3 excepting the attaching seat outer peripheral vicinal part 19 and the thickness T2 of the solid layer 27 of the attaching seat outer peripheral vicinal part 19 is set to T1=(1.7-3.3)×T2. The relation between the dimension L1 from the center O of the attaching seat 7 to the inner peripheral edge of the opening part 15 of the base end on the side of the panel main body 3 and the dimension L2 from the center O of the attaching seat 7 to the outer edge of the attaching seat outer peripheral vicinal part 19 is set to L2=(1.4-1.7)×L1. COPYRIGHT: (C)2007,JPO&INPIT |
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Bibliography: | Application Number: JP20050180093 |