MOVABLE ELEMENT, SEMICONDUCTOR DEVICE WITH THE SAME INCORPORATED THEREIN, MODULE AND ELECTRONIC APPARATUS

• Main Author: AKIBA AKIRA
• Format: Patent
• Language: English
• Published: 28.12.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SWITCHES; ELECTRICITY; EMERGENCY PROTECTIVE DEVICES; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; RELAYS; SELECTORS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a movable element facilitating a manufacturing process, never disturbing reduction of a package size, and having low voltage/low power consumption to an extent allowing itself to be integrally formed with a low voltage/low power consumption-based element; to provide a semiconductor device with the movable element incorporated therein; to provide a module; and to provide an electronic apparatus. SOLUTION: This movable element is provided, on a semiconductor substrate 10, with: a signal line 11 for transmitting a signal; a connection/disconnection part 12 for mechanically connecting and disconnecting the signal line; switching parts 13 for switching the connection/disconnection part 12; and holding parts 14 for holding a state after the switching of the connection/disconnection part 12. Each switching part 13 has a movable piece 13B and the connection/disconnection part 12 and each holding part 14 have a set of stationary pieces 12A and 14A and movable pieces 12B and 14B arranged oppositely to each other, respectively; and the movable piece 14B of the holding part 14 is connected to the respective movable pieces 12B and 13B of the connection/disconnection part 12 and the switching part 13 through elastic parts 15. COPYRIGHT: (C)2007,JPO&INPIT