PLASMA TREATMENT APPARATUS
PROBLEM TO BE SOLVED: To prevent the occurrence of abnormal discharging at the bottom face side of a substrate, in a plasma treatment apparatus wherein a heat transfer gas is supplied at the top face side of the substrate. SOLUTION: The plasma treatment apparatus comprises a holding plate 23 for hol...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
21.12.2006
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To prevent the occurrence of abnormal discharging at the bottom face side of a substrate, in a plasma treatment apparatus wherein a heat transfer gas is supplied at the top face side of the substrate. SOLUTION: The plasma treatment apparatus comprises a holding plate 23 for holding the substrate 2 by electrostatic suction, and an electrode plate 24 to be applied with high-frequency voltage. A nozzle member 43 formed of an insulating material which is stored in the upper storage hole 31 of the holding plate 23 is formed with a plurality of upper-side gas supply holes 44 having a very small diameter. Meanwhile, an entrance member 47 formed of an insulating material which is stored in a lower-side storage hole 39 of the electrode plate 24 is formed with a lower-side gas supply hole 48 for supplying the heat transfer gas to the upper-side gas supply holes 44. The lower-side storage hole 39 has a diameter larger than that of the upper-side storage hole 31. Between the top end face 47a of the entrance member 47 and the bottom face 23b of the holding plate 23, an insulating adhesive layer 52 is formed. COPYRIGHT: (C)2007,JPO&INPIT |
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Bibliography: | Application Number: JP20050169116 |