SEMICONDUCTOR APPARATUS

PROBLEM TO BE SOLVED: To reduce variations in forward voltage VF of a temperature-sensitive diode that occur for each semiconductor chip. SOLUTION: The semiconductor apparatus is provided with a plurality of resistors 31-34 and a wiring 35 respectively connected with each other while being branched...

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Bibliographic Details
Main Authors TEJIMA TAKANORI, OHAMA KENICHI
Format Patent
LanguageEnglish
Published 21.12.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING QUANTITY OF HEAT
MEASURING TEMPERATURE
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
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Summary:PROBLEM TO BE SOLVED: To reduce variations in forward voltage VF of a temperature-sensitive diode that occur for each semiconductor chip. SOLUTION: The semiconductor apparatus is provided with a plurality of resistors 31-34 and a wiring 35 respectively connected with each other while being branched from the temperature-sensitive diode 20, pads 41-45 provided respectively corresponding to a plurality of the resistors 31-34 and the wiring 35, and a pad 10 provided to the side opposite to a plurality of the resistors 31-34 and the wiring 35 in the temperature-sensitive diode 20. A plurality of paths are composed including the temperature-sensitive diodes 20 between the pad 10 and the pads 41-45. Any one of a plurality of the resistors 31-34 or the wiring 35 is selected so that a temperature between the pad 10 and the pads 41-45 is within a desired range. The path including the selected resistor or the wiring is used. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20050168044