IN-SITE CAP AND METHOD FOR MANUFACTURING IN-SITE CAP FOR INTEGRATED CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To provide an improved in-site cap for an integrated circuit device including a micro machine device, a method for manufacturing the in-site cap, and provide such a cap and a method of using a basic IC circuit manufacturing process for manufacturing the cap. SOLUTION: The metho...

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Bibliographic Details
Main Authors MARTIN JOHN R, MORRISON JR RICHARD H
Format Patent
LanguageEnglish
Published 07.12.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC SWITCHES
ELECTRICITY
EMERGENCY PROTECTIVE DEVICES
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
RELAYS
SELECTORS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide an improved in-site cap for an integrated circuit device including a micro machine device, a method for manufacturing the in-site cap, and provide such a cap and a method of using a basic IC circuit manufacturing process for manufacturing the cap. SOLUTION: The method for manufacturing the in-site cap (40) comprises the steps of forming an integrated circuit element (122) on a substrate (14) and the in-site cap for the integrated circuit device (10) such as a micro-machine, forming a support layer (124) on the integrated circuit element (122) and forming a cap structure (22) on the support layer (124) covering the integrated circuit element (122). COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20060217336