POLISHING DEVICE

• Main Author: UJIHARA TAKASHI
• Format: Patent
• Language: English
• Published: 07.12.2006
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a polishing device having extremely excellent practical use which can perform excellent polishing even if a pattern shape or thin film made of a soft material or a hard material is formed on the surface of the substrate. SOLUTION: The polishing device polishing the surface of the substrate 1 is equipped with a polishing head P having a polishing material where a lot of hair-like bodies 32 having flexibility and integrating abrasive grains 31 are formed on the base surface 33. The surface of the substrate 1 can be scraped with the hair-like bodies 32 integrating the abrasive grains 31 by oscillating the polishing material or the substrate 1 in such a state that the polishing material provided on the polishing head P is contacted to the surface of the substrate 1. The length and the flexibility of the hair-like bodies 32 are set so that not only the protruded part of the top face of the irregularity part, but also the recessed part of the bottom face can be polished when the polishing material is contacted to the surface of the substrate having irregularity part. COPYRIGHT: (C)2007,JPO&INPIT