SEMICONDUCTOR CHIP AND SEMICONDUCTOR CHIP PACKAGE

• Main Author: KIM JONG-KEE
• Format: Patent
• Language: English
• Published: 24.11.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor chip the operation reliability of which can be enhanced by effectively discharging heat generated in the semiconductor chip without damaging active devices in the semiconductor chip, and a semiconductor chip package. SOLUTION: A semiconductor chip com...