SEMICONDUCTOR CHIP AND SEMICONDUCTOR CHIP PACKAGE

• Main Author: KIM JONG-KEE
• Format: Patent
• Language: English
• Published: 24.11.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor chip the operation reliability of which can be enhanced by effectively discharging heat generated in the semiconductor chip without damaging active devices in the semiconductor chip, and a semiconductor chip package. SOLUTION: A semiconductor chip comprises: multiple channel blocks 133 each of which has multiple channels consisting of multiple unit devices; multiple first metal interconnection lines connected to the multiple unit devices respectively for sending and receiving data to/from external devices; multiple normal bumps 139 for externally connecting data signals transmitted through the first metal interconnection lines; multiple second metal interconnection lines which are placed in spaces between the channel blocks and are connected to a substrate or multiple well regions; and multiple first heat transfer bumps 138 that are placed over the second metal interconnection lines to transfer heat generated while driving the channel blocks to external interconnection lines through the second metal interconnection lines. COPYRIGHT: (C)2007,JPO&INPIT