THERMOSETTING RESIN COMPOSITION FOR MOLDING MATERIAL, MOLDING MATERIAL USING IT AND MOLDED ARTICLE

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for a molding material capable of reducing generation of a gas at curing without impairing flowability of the molding material, effectively suppressing generation of gas defect at the inside of the obtained molded article and exhibit...

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Bibliographic Details
Main Authors OTSUBO NARIMITSU, KANEIWA TOSHIHIKO
Format Patent
LanguageEnglish
Published 09.11.2006
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for a molding material capable of reducing generation of a gas at curing without impairing flowability of the molding material, effectively suppressing generation of gas defect at the inside of the obtained molded article and exhibiting excellent mechanical strength of the molded article. SOLUTION: In the thermoset resin composition for the molding material, a phenol resin (A) comprising a benzylic ether type resol having a weight average molecular weight of 4,000 or less; and a thermoset phenol resin (B) having a weight average molecular weight of 5,000 or more and a solubility to boiled methanol of 70 wt.% or more are formulated as indispensable constitution components. COPYRIGHT: (C)2007,JPO&INPIT
Bibliography:Application Number: JP20060088866