CLEANING LIQUID AND METHOD FOR FORMING METALLIC PATTERN OF SEMICONDUCTOR DEVICE USING THE SAME
PROBLEM TO BE SOLVED: To provide a cleaning liquid and a method for forming a metallic pattern of a semiconductor device. SOLUTION: The cleaning liquid contains acetic acid, inorganic acid, a fluorine compound, and deionized water, and the method for forming a metallic pattern uses the same. The cle...
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Main Authors | , , , , , , , , , , , |
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Format | Patent |
Language | English |
Published |
26.10.2006
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a cleaning liquid and a method for forming a metallic pattern of a semiconductor device. SOLUTION: The cleaning liquid contains acetic acid, inorganic acid, a fluorine compound, and deionized water, and the method for forming a metallic pattern uses the same. The cleaning liquid may further contain a corrosion inhibitor, a chelating agent, or a combination of these. For the metallic pattern formation method, a metal film composed of Ru is formed on a substrate. Part of the metal film is dry-etched to form a metal pattern. Using a compound liquid containing acetic acid, inorganic acid, a fluorine compound, and deionized water, the metal film pattern is cleaned to remove etching by-product layers around the metal film pattern. When an oxide film pattern is used as an etching mask to form a metal film pattern, the oxide film pattern is formed and then, the cleaning liquid is used to remove the etching by-product layers around the oxide film pattern before dry-etching the metal film. COPYRIGHT: (C)2007,JPO&INPIT |
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Bibliography: | Application Number: JP20060110175 |