IMMERSION PROCESSING DEVICE

PROBLEM TO BE SOLVED: To provide an immersion processing device where the variation in the flow velocity of a liquid flow in the surface of the object to be treated is eliminated, and further, the liquid flow in the surface of the object to be treated can be controlled to the desired flow velocity....

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Bibliographic Details
Main Author TOBA RITSUJI
Format Patent
LanguageEnglish
Published 28.09.2006
Subjects
APPARATUS THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PROBLEM TO BE SOLVED: To provide an immersion processing device where the variation in the flow velocity of a liquid flow in the surface of the object to be treated is eliminated, and further, the liquid flow in the surface of the object to be treated can be controlled to the desired flow velocity. SOLUTION: The immersion processing device comprises: a plating tank 22 filled with a plating liquid, and to which the material to be plated 10 is dipped; each anode chamber 40 arranged at the side direction of the material to be plated 10, having a cation exchange membrane 42 and filled with an electrolytic solution; each insoluble anode 48 provided at the inside of the anode chamber 40 so as to be separated from the plating liquid and opposed to the material to be plated 10 via the cation exchange membrane 42; and a blowout unit 52 of forming a flow of the plating liquid flowing from the lower part toward the upper part in the plating tank 22 between the material to be plated 10 and each anode chamber 40. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20050072871