ADHESIVE-REMOVING MATERIAL

PROBLEM TO BE SOLVED: To obtain an adhesive-removing material capable of easily removing adhesives. SOLUTION: The adhesive-removing material is obtained by dispersing microparticles 0.1-500μm in average size in an elastomeric matrix. In this adhesive-removing material, an organic compound or the lik...

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Bibliographic Details
Main Authors MOCHIZUKI AKIOMI, ARIFUKU MASAHIRO, KOBAYASHI KOJI, NAKAZAWA TAKASHI
Format Patent
LanguageEnglish
Published 14.09.2006
Subjects
ADHESIVES
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CORRECTING FLUIDS
DYES
FILLING PASTES
INKS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:PROBLEM TO BE SOLVED: To obtain an adhesive-removing material capable of easily removing adhesives. SOLUTION: The adhesive-removing material is obtained by dispersing microparticles 0.1-500μm in average size in an elastomeric matrix. In this adhesive-removing material, an organic compound or the like of ≥10,000 average molecular weight(preferably a rubber or the like) can be used as the elastomeric matrix, and as the microparticles, those being ≥1 GPa in modulus can be used, for example, preferably being silica, TiO2, Al2O3. Preferably. this material can be used for removing circuit-connecting adhesives such as anisotropic electrically conductive adhesives. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20050061921