SEMICONDUCTOR APPARATUS AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor apparatus which can ensure electrical connection in high reliability without dislocation between a projecting electrode and a land while the joint is filled with a sealing resin without voids. SOLUTION: The semiconductor apparatus is formed by flip-ch...

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Bibliographic Details
Main Author OKIMOTO RIKIYA
Format Patent
LanguageEnglish
Published 10.08.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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