SEMICONDUCTOR APPARATUS AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor apparatus which can ensure electrical connection in high reliability without dislocation between a projecting electrode and a land while the joint is filled with a sealing resin without voids. SOLUTION: The semiconductor apparatus is formed by flip-ch...

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Bibliographic Details
Main Author OKIMOTO RIKIYA
Format Patent
LanguageEnglish
Published 10.08.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor apparatus which can ensure electrical connection in high reliability without dislocation between a projecting electrode and a land while the joint is filled with a sealing resin without voids. SOLUTION: The semiconductor apparatus is formed by flip-chip mounting a semiconductor device 1 on a circuit board 2, and filling a sealing resin 7 between the semiconductor device 1 and the circuit board 2. In this case, a projecting electrode 4 is provided on the electrode 3 of the semiconductor device 1. A position regulating projection 6 such as an interrupting annular projection is provided to form an open groove 9 for opening to the side a recessed hole 8 and the internal space of the recessed hole 8 to which the tip end of the projecting electrode 4 is inserted, in a land 5 to be bonded with the projecting electrode 4 of the circuit board 2. The dislocation of the projecting electrode 4 can be prevented by the position regulating projection 6, and the sealing resin 7 can be charged by the open groove 9 without producing voids. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20050019710