SURFACE-MOUNTING SEMICONDUCTOR ELEMENT

• Main Authors: KAMIKAWA TOSHIMI, MIYAMURA SHINICHI, OBA ISATO
• Format: Patent
• Language: English
• Published: 03.08.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a surface-mounting semiconductor element which uses a lead frame which can suppress a stress applied on a package by a load in forming, in the process in which in a part protruding from the package, the lead frame which is formed by insert-molding of a resin and protrudes from the package is subjected to forming process. SOLUTION: At a center of leads 5, 7 at a position where a pair of leads 5, 7 protruding to the side from a side face of a package 11 are bent at a substantially right angle along the side face of the package 11, a recess 10 not penetrating the leads 5, 7 is provided partially. The sectional area of the bending part of the leads 5, 7 is reduced, whereby the leads 5, 7 are easily bent by a small bending load. Thus, it is possible to materialize the surface mounting type semiconductor element which suppresses a disconnection without damaging heat radiation properties and has a superior humidity resistance. COPYRIGHT: (C)2006,JPO&NCIPI