DEVICE AND METHOD FOR DETECTING SUBSTRATE ON POLISHING PAD
PROBLEM TO BE SOLVED: To provide a method for detecting a silicon substrate dislocated from a carrier on a polishing cloth even if the polishing cloth used for polishing the substrate is black. SOLUTION: A predetermined position S1on the polishing cloth 11 is irradiated with first inspection light f...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
03.08.2006
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a method for detecting a silicon substrate dislocated from a carrier on a polishing cloth even if the polishing cloth used for polishing the substrate is black. SOLUTION: A predetermined position S1on the polishing cloth 11 is irradiated with first inspection light from a first reflection sensor A apparatus at an angle of 15° from the upper face side of the polishing pad. A first light receiving element signal P1of the quantity of reflected light is compared with a threshold Lw, and an on/off signal is transmitted from a first relay A. At the same time, the predetermined position S1on the polishing cloth 11 is irradiated with second inspection light from a second reflection sensor B apparatus at an angle of 5° from the upper face side of the polishing pad. A second light quantity signal P2of the quantity of reflected light is compared with a threshold Lb, and an on/off signal is transmitted from a second relay B. When the combination of the on/off signals transmitted from the respective relays A, B is the same (on and on), an "on" alarm signal meaning the occurrence of dislocation of the substrate on the polishing pad is output to a sequence of an index head type polishing device 30. COPYRIGHT: (C)2006,JPO&NCIPI |
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Bibliography: | Application Number: JP20050009813 |