SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device having electric wiring, in which electric wiring for a pad which electrically connects an electrostatic protection element and an electrode pad in the semiconductor device where a bump is formed on an active face and power supply electric wirin...

Full description

Saved in:
Bibliographic Details
Main Author SAIKI TAKAYUKI
Format Patent
LanguageEnglish
Published 27.07.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device having electric wiring, in which electric wiring for a pad which electrically connects an electrostatic protection element and an electrode pad in the semiconductor device where a bump is formed on an active face and power supply electric wiring which is electrically connected to a power supply are arranged without remarkably increasing an area that the semiconductor device has and without short-circuiting it. SOLUTION: The semiconductor device is provided with electric wiring for a pad which electrically connects the pad electrode and the electrostatic protection element and power supply electric wiring which is electrically connected to the power supply. In an electric wiring layer being a part of multilayer wiring used as electric wiring for the power supply, electric wiring for a pad and electric wiring for the power supply are arranged in a center of a region where the electrostatic protection element is formed so that they are not overlapped on the electrostatic protection element. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20050003420