THERMOPLASTIC RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition having high stiffness and high fluidity, excellent in appearance with less surface exfoliation of the molding, suitably utilizable for structural components of automobiles and structural components of electric or electronic products....

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Bibliographic Details
Main Authors SHIAKU TOSHIO, KATSUMATA TORU, TAGUCHI YOSHIAKI
Format Patent
LanguageEnglish
Published 20.07.2006
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition having high stiffness and high fluidity, excellent in appearance with less surface exfoliation of the molding, suitably utilizable for structural components of automobiles and structural components of electric or electronic products. SOLUTION: This thermoplastic resin composition comprises 100 pts.wt. of solely a polybenzimidazole resin or a mixed thermoplastic resin (A) comprising 70-20 wt.% of a polybenzimidazole resin and 30-80 wt.% of a polyetherketone resin blended with 5-100 pts.wt. of a liquid crystalline polyesteramide resin (B) which contains one or more kinds from among 4-aminophenol, 1,4-phenylenediamine, 4-aminobenzoic acid and derivatives thereof as constituting monomers, where the amide component is contained by a ratio of 3-35 mol% in total linkages. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20050277857