OBJECT PROCESSING METHOD AND DEVICE THEREOF

PROBLEM TO BE SOLVED: To provide an object processing method capable of sufficiently removing not only the residue of an insulating film side wall for a wafer but also reaction by-products and residue or particles which are made amorphous at the bottom of a via, and capable of reducing costs spent f...

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Bibliographic Details
Main Authors TAJIMA KAORI, MORITA NARITAKA, SUZUKI TAKESHI, ARIGA MICHIO, SAITO KOICHI
Format Patent
LanguageEnglish
Published 13.07.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an object processing method capable of sufficiently removing not only the residue of an insulating film side wall for a wafer but also reaction by-products and residue or particles which are made amorphous at the bottom of a via, and capable of reducing costs spent for processing facility and chemical solution purchase remarkably compared with conventional method while being capable of shortening a processing time also. SOLUTION: The object processing method removes unnecessary matter on the objective processing surface of the object equipped with the objective processing surface with a plurality of holes. The method comprises a chemical solution treatment process for contacting mixed solution containing aqueous ammonia and oxygenated water with the objective surface of processing; and a removing treatment process for removing the unnecessary matter by applying at least one of pressurized steam or water against the objective processing surface contacted with the mixed solution. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040377433