Abstract PROBLEM TO BE SOLVED: To provide a method capable of achieving superior power distribution impedance reduction combined with improved voltage response to accommodate higher IC switching speeds, and to provide such a device and method of making the device. SOLUTION: A power core comprises at least one embedded surface-mount-technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor 410, and at least one planar capacitor laminate 320. At least one planar capacitor laminate 320 serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor 410, and the embedded SMT discrete chip capacitor 410 is connected in parallel to the planar capacitor laminate 320. COPYRIGHT: (C)2006,JPO&NCIPI
AbstractList PROBLEM TO BE SOLVED: To provide a method capable of achieving superior power distribution impedance reduction combined with improved voltage response to accommodate higher IC switching speeds, and to provide such a device and method of making the device. SOLUTION: A power core comprises at least one embedded surface-mount-technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor 410, and at least one planar capacitor laminate 320. At least one planar capacitor laminate 320 serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor 410, and the embedded SMT discrete chip capacitor 410 is connected in parallel to the planar capacitor laminate 320. COPYRIGHT: (C)2006,JPO&NCIPI
Author BANERJI SOUNAK
MCGREGOR DAVID ROSS
DIETZ KARL HARTMANN
AMEY DANIEL I JR
BORLAND WILLIAM J
SREERAM ATTIGANAL N
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– fullname: BORLAND WILLIAM J
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Snippet PROBLEM TO BE SOLVED: To provide a method capable of achieving superior power distribution impedance reduction combined with improved voltage response to...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
Title POWER CORE DEVICE AND METHOD OF MAKING THEREOF
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