POWER CORE DEVICE AND METHOD OF MAKING THEREOF
PROBLEM TO BE SOLVED: To provide a method capable of achieving superior power distribution impedance reduction combined with improved voltage response to accommodate higher IC switching speeds, and to provide such a device and method of making the device. SOLUTION: A power core comprises at least on...
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Format | Patent |
Language | English |
Published |
06.07.2006
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Abstract | PROBLEM TO BE SOLVED: To provide a method capable of achieving superior power distribution impedance reduction combined with improved voltage response to accommodate higher IC switching speeds, and to provide such a device and method of making the device. SOLUTION: A power core comprises at least one embedded surface-mount-technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor 410, and at least one planar capacitor laminate 320. At least one planar capacitor laminate 320 serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor 410, and the embedded SMT discrete chip capacitor 410 is connected in parallel to the planar capacitor laminate 320. COPYRIGHT: (C)2006,JPO&NCIPI |
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AbstractList | PROBLEM TO BE SOLVED: To provide a method capable of achieving superior power distribution impedance reduction combined with improved voltage response to accommodate higher IC switching speeds, and to provide such a device and method of making the device. SOLUTION: A power core comprises at least one embedded surface-mount-technology (SMT) discrete chip capacitor layer comprising at least one embedded SMT discrete chip capacitor 410, and at least one planar capacitor laminate 320. At least one planar capacitor laminate 320 serves as a low inductance path to supply a charge to at least one embedded SMT discrete chip capacitor 410, and the embedded SMT discrete chip capacitor 410 is connected in parallel to the planar capacitor laminate 320. COPYRIGHT: (C)2006,JPO&NCIPI |
Author | BANERJI SOUNAK MCGREGOR DAVID ROSS DIETZ KARL HARTMANN AMEY DANIEL I JR BORLAND WILLIAM J SREERAM ATTIGANAL N |
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Snippet | PROBLEM TO BE SOLVED: To provide a method capable of achieving superior power distribution impedance reduction combined with improved voltage response to... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE |
Title | POWER CORE DEVICE AND METHOD OF MAKING THEREOF |
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