LASER CUTTING METHOD AND APPARATUS

• Main Authors: YONEUCHI TOSHIFUMI, TOYODA MITSUHIRO, OMORI KENICHI, KUSAMA HIDEAKI
• Format: Patent
• Language: English
• Published: 06.07.2006
• Subjects: CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; GLASS; MACHINE TOOLS; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MINERAL OR SLAG WOOL; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

PROBLEM TO BE SOLVED: To solve the conventional problem of inferior cutting due to a shallow scribed line since its growth in the thickness direction does not take place at the point of time of ultraviolet laser irradiation but takes place subsequently by thermal stress by infrared laser, in a laser cutting apparatus that actuates the thermal stress by infrared laser after scribing by ultraviolet laser. SOLUTION: In the laser cutting method, a substrate 1 made of a brittle material is scribed by continuously forming machining points 3 on the surface by irradiating it with ultraviolet laser. In a state a compressive stress is actuated around the machining points 3 position of the substrate 1, while the substrate 1 and the ultraviolet laser 101a are relatively moved, the machining points 3 are formed by irradiating the surface of the substrate 1 with the ultraviolet laser 101a. By forming the machining points 3, the compressive stress is removed around the machining points 3 of the substrate 1, thereby making the scribed line 103 grow in the thickness direction of the substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI