PORTABLE TERMINAL DEVICE AND HEAT DISSIPATING METHOD
PROBLEM TO BE SOLVED: To provide a portable terminal device and a heat dissipating method, through which a local temperature rise caused by heat released from internal electronic components can be prevented from occurring inside the device. SOLUTION: A heat conduction layer 17 composed of one or mor...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | English |
Published |
29.06.2006
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PROBLEM TO BE SOLVED: To provide a portable terminal device and a heat dissipating method, through which a local temperature rise caused by heat released from internal electronic components can be prevented from occurring inside the device. SOLUTION: A heat conduction layer 17 composed of one or more layers and formed of materials excellent in thermal conductivity, such as copper, aluminum, carbon, etc, is provided inside a board 13 where the electronic component 14 is mounted; heat released from the electronic component 14 is quickly diffused through the heat conduction layer 17 in the plane direction of the board 13 and conducted to an operating means, such as keys 16 etc, and a case from the whole surface of the board 13 to dissipate outside. By this setup, a local temperature rise of the operating means and the case is restrained so as to keep the surface of the portable communication device uniform in temperature without increasing the cost and thickness of the portable communication device. An electronic part of high performance can be used by the use of the above structure, and furthermore the board is increased in rigidity to improve the reliability of the portable terminal device. COPYRIGHT: (C)2006,JPO&NCIPI |
---|---|
Bibliography: | Application Number: JP20040362272 |