SIEVE MACHINE

PROBLEM TO BE SOLVED: To provide a sieve machine which improves the durability by enhancing the abrasion resistance of lattices for sieving while assuring the impact resistance. SOLUTION: In the sieve machine having a plurality of lattice materials 1 arranged in a predetermined distance, a hard laye...

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Bibliographic Details
Main Author HONDA TSUGUO
Format Patent
LanguageEnglish
Published 29.06.2006
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Summary:PROBLEM TO BE SOLVED: To provide a sieve machine which improves the durability by enhancing the abrasion resistance of lattices for sieving while assuring the impact resistance. SOLUTION: In the sieve machine having a plurality of lattice materials 1 arranged in a predetermined distance, a hard layer 2 is formed on the opening face of the lattice material 1 by welding overlay. The thickness (W-w) of the hard layer 2 occupies 10-70% of the total thickness(W) of the lattice material 1 including the hard layer 2. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040362573