MANUFACTURING METHOD OF SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor module that does not have complicated processes for manufacturing semiconductor module having high electrical connection reliability. SOLUTION: The manufacturing method of semiconductor module comprises the steps of (1) bonding...

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Bibliographic Details
Main Authors HODONO MASAYUKI, MIKI KAZUYUKI, NORO KOJI
Format Patent
LanguageEnglish
Published 22.06.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor module that does not have complicated processes for manufacturing semiconductor module having high electrical connection reliability. SOLUTION: The manufacturing method of semiconductor module comprises the steps of (1) bonding electronic components to a bonding sheet, (2) sealing the electronic components to the bonding sheet using resin, (3) peeling the bonding sheet, (4) attaching the thermoplastic resin sheet to the part where the bonding sheet is peeled in the step (3), (5) boring holes to the thermoplastic resin sheet to expose the connecting terminals of the electronic components, and (6) forming the wires by connecting the connecting terminals with conductive ink. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040350228