MANUFACTURING METHOD OF SEMICONDUCTOR MODULE

• Main Authors: HODONO MASAYUKI, MIKI KAZUYUKI, NORO KOJI
• Format: Patent
• Language: English
• Published: 22.06.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor module that can obtain high electrical connection reliability and having high material efficiency. SOLUTION: The manufacturing method of semiconductor module comprises the steps of (1) bonding electronic components to a bonding...