MANUFACTURING METHOD OF SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor module that can obtain high electrical connection reliability and having high material efficiency. SOLUTION: The manufacturing method of semiconductor module comprises the steps of (1) bonding electronic components to a bonding...

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Bibliographic Details
Main Authors HODONO MASAYUKI, MIKI KAZUYUKI, NORO KOJI
Format Patent
LanguageEnglish
Published 22.06.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor module that can obtain high electrical connection reliability and having high material efficiency. SOLUTION: The manufacturing method of semiconductor module comprises the steps of (1) bonding electronic components to a bonding sheet, (2) sealing electronic components bonded to the bonding sheet, (3) boring holes to the bonding sheet to expose the connecting terminals of the electronic components, and (4) forming the wires by connecting the exposed connecting terminals with conductive ink. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040350225