MANUFACTURING METHOD OF SEMICONDUCTOR MODULE
PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor module that can obtain high electrical connection reliability and having high material efficiency. SOLUTION: The manufacturing method of semiconductor module comprises the steps of (1) bonding electronic components to a bonding...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
22.06.2006
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| Subjects | |
| Online Access | Get full text |
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| Abstract | PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor module that can obtain high electrical connection reliability and having high material efficiency. SOLUTION: The manufacturing method of semiconductor module comprises the steps of (1) bonding electronic components to a bonding sheet, (2) sealing electronic components bonded to the bonding sheet, (3) boring holes to the bonding sheet to expose the connecting terminals of the electronic components, and (4) forming the wires by connecting the exposed connecting terminals with conductive ink. COPYRIGHT: (C)2006,JPO&NCIPI |
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| AbstractList | PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor module that can obtain high electrical connection reliability and having high material efficiency. SOLUTION: The manufacturing method of semiconductor module comprises the steps of (1) bonding electronic components to a bonding sheet, (2) sealing electronic components bonded to the bonding sheet, (3) boring holes to the bonding sheet to expose the connecting terminals of the electronic components, and (4) forming the wires by connecting the exposed connecting terminals with conductive ink. COPYRIGHT: (C)2006,JPO&NCIPI |
| Author | HODONO MASAYUKI MIKI KAZUYUKI NORO KOJI |
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| Notes | Application Number: JP20040350225 |
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| PublicationDateYYYYMMDD | 2006-06-22 |
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| RelatedCompanies | NITTO DENKO CORP |
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| Snippet | PROBLEM TO BE SOLVED: To provide a manufacturing method of semiconductor module that can obtain high electrical connection reliability and having high material... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | MANUFACTURING METHOD OF SEMICONDUCTOR MODULE |
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