CERAMIC WIRING BOARD

PROBLEM TO BE SOLVED: To improve the strength of adhesion between a wiring circuit layer and an insulating layer on the surface of a ceramic substrate in a ceramic wiring board. SOLUTION: The ceramic wiring board 9 is provided with the insulating layer 1, and the wiring circuit layer 3 formed on the...

Full description

Saved in:
Bibliographic Details
Main Author NAGAE KENICHI
Format Patent
LanguageEnglish
Published 15.06.2006
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To improve the strength of adhesion between a wiring circuit layer and an insulating layer on the surface of a ceramic substrate in a ceramic wiring board. SOLUTION: The ceramic wiring board 9 is provided with the insulating layer 1, and the wiring circuit layer 3 formed on the surface or inside of the insulating layer 1. Between the insulating layer 1 and a surface-layer wiring circuit layer 3a at the end of the surface-layer wiring circuit layer 3a formed at least one main surface of the ceramic wiring board 9, an insulating adhesive layer 11 is formed which can be sintered more easily than the insulating layer 1. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040341660