PHENOL RESIN COMPOSITE

PROBLEM TO BE SOLVED: To provide a phenol resin composite that can suitably suppress the occurrence of voids and cracks. SOLUTION: This phenol resin composite is composed of a phenol resin and a carbon-base material. The total content of phenol monomer and phenol dimer is preferably not more than 10...

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Bibliographic Details
Main Authors TAGAMI NOBORU, KANEIWA TOSHIHIKO
Format Patent
LanguageEnglish
Published 15.06.2006
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a phenol resin composite that can suitably suppress the occurrence of voids and cracks. SOLUTION: This phenol resin composite is composed of a phenol resin and a carbon-base material. The total content of phenol monomer and phenol dimer is preferably not more than 10 mass%, more preferably not more than 3 mass%. The molecular weight distribution (namely weight average molecular weight/number-average molecular weight) is preferably set to 1.1 to 2.0, more preferably to 1.3 to 1.6. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040342575