CONDUCTIVE PATTERN AND METHOD OF FORMING IT

• Main Author: YASUDA RYOICHI
• Format: Patent
• Language: English
• Published: 08.06.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a conductive pattern which can apply an organic molecule also to a conductive material including an organic molecule which can be formed accurately certainly, in which a conductive material is not limited to a hydrophilic object, the thickness of a conductive pattern is not restricted by the risk of pattern collapse, which can be formed with sufficient productivity and can be applied to the conductive material including an organic molecule. SOLUTION: First, a photoresist layer 5 which divides a region for forming a channel region for forming a channel part by an organic semiconductor as a recess 6 on a silicon substrate 1. Then, the hydrophilic treatment of ashing by oxygen plasma, ozonization under ultraviolet light irradiation, etc., is performed, and a hydrophilic group 7 is formed on the front surface of the substrate. Then, the front surface of the substrate is covered with a mixed solution of the water of a hydrophilic organic semiconductor module (PEDOT/PSS) by application. Moisture is evaporated, and an organic semiconductor layer 8 is formed in the recess 6. Then, the photoresist layer 5 is exfoliated from the front surface of the substrate by lift-off processing. Thereby, electric insulating between each conductive pattern 8 is guaranteed. COPYRIGHT: (C)2006,JPO&NCIPI