ELECTRONIC COMPONENT MOUNTING DEVICE

PROBLEM TO BE SOLVED: To provide an electronic component mounting device where an electronic component can efficiently be mounted. SOLUTION: In the electronic component mounting device 100, a mutual loading operation that the other loading head 7 loads the electronic component held from a component...

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Bibliographic Details
Main Authors SAITO MASARU, HACHIMAN NAOYUKI, ANZAI HIROSHI
Format Patent
LanguageEnglish
Published 08.06.2006
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide an electronic component mounting device where an electronic component can efficiently be mounted. SOLUTION: In the electronic component mounting device 100, a mutual loading operation that the other loading head 7 loads the electronic component held from a component supply part 5 on a substrate P held by a substrate station 3 while at least one loading head 7 holds the electronic component from the component supply part 5 and a synchronous loading operation for synchronously holding the electronic component from the component supply part 5 by a plurality of the loading heads 7 and for loading the electronic component held from the component supply part 5 on the substrate P held by the substrate station 3 are switched. The electronic component is loaded on the substrate P by the respective component loading operations. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040331647