POLYIMIDE FORM AND METHOD FOR PRODUCING THE SAME

• Main Authors: MORINO MORIO, KAWAHARA KEIZO, MAEDA SATOSHI
• Format: Patent
• Language: English
• Published: 08.06.2006
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

PROBLEM TO BE SOLVED: To provide a polyimide form reduced in relatively high hygroscopicity inherent in polyimide while retaining the high functionality of the form, especially film, thus provided with such performances that its electrical insulation is not highly affected by humidity when used in the electrical/electronic material field, and to provide a method for producing the polyimide form. SOLUTION: The polyimide form is characterized by being formed from a resin composition comprising (A) 40-90 mass% of a polyimide resin and (B) 10-60 mass% of hydrophobic polymeric powder ≤0.5 mass% in water absorption, ≥300°C in thermal decomposition temperature and ≤50μm in volume-average particle size D. The method for producing the polyimide form comprises the step of incorporating the hydrophobic polymeric powder in a polyamic acid solution as polyimide precursor, an initially forming step, a primarily drying step and the step of heat treatment at a temperature higher than the softening point but lower than the thermal decomposition temperature of the hydrophobic polymeric resin. COPYRIGHT: (C)2006,JPO&NCIPI