COOLING METHOD AND APPARATUS THEREOF

PROBLEM TO BE SOLVED: To provide a cooling method and a cooling apparatus for enabling high speed and higher heat removal with a small size and simplified structure. SOLUTION: A plurality of narrow-width evaporating grooves 13 opening to the side of a vapor path are formed on the side surface of the...

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Bibliographic Details
Main Authors TSUKAMOTO TAKAGI, IMAI RYOJI
Format Patent
LanguageEnglish
Published 01.06.2006
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a cooling method and a cooling apparatus for enabling high speed and higher heat removal with a small size and simplified structure. SOLUTION: A plurality of narrow-width evaporating grooves 13 opening to the side of a vapor path are formed on the side surface of the vapor path of a solid-state wall 5 with one side surface thereof placed in contact with a heat generating body while the other side surface thereof placed in contact with the vapor path. Simultaneously, the end of each evaporating groove 13 is communicated with the liquid supplying chambers 11, 12, and a liquid introducing device 19 is provided at side ends of the liquid chambers 11, 12 of the evaporating groove 13 in order to supply liquids in the liquid supplying chambers 11 and 12 to each evaporating groove 13. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040327455