CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide the manufacturing method of a circuit board which hardly generates defects and a circuit board using it which is excellent in heat dissipation property, and has high junction strength and is excellent in junction reliability. SOLUTION: An adhesive 3 which comprises m...

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Bibliographic Details
Main Authors YOSHIHARA YASUHIKO, TERASONO HIROBUMI, TERAO SHINYA
Format Patent
LanguageEnglish
Published 11.05.2006
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide the manufacturing method of a circuit board which hardly generates defects and a circuit board using it which is excellent in heat dissipation property, and has high junction strength and is excellent in junction reliability. SOLUTION: An adhesive 3 which comprises metallic fine particle having an average particle diameter of 1 to 100 nm and at least one kind of active metal selected from Ti, Zr, Hf and Nb is interposed between an insulating substrate 1 and a metallic plate 5. The method has a junction process for joining the insulating substrate 1 and the metallic plate 5 by heating a lamination body to a junction temperature less than a melting point of the metallic fine particle. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040309306