POLYOLEFINIC RESIN FOAMED PARTICLE AND IN-MOLD MOLDING USING IT

• Main Authors: TANIGUCHI TOMOYUKI, HARADA SEIICHIRO
• Format: Patent
• Language: English
• Published: 11.05.2006
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To provide polyolefinic resin foamed particles which have no transfer (no stain) and no electrical interference to a packaged object and have the antistatic performance level stably and permanently, and to provide an in-mold foamed body for use in cushioning packaging materials used for transporting electronics- and electricity-related equipment by using this foamed particle. SOLUTION: The polyolefinic resin foamed particle is characterized by having on the surface an adhesive resin layer containing electroconductive zinc oxide, with the above electroconductive zinc oxide having a particle diameter of preferably 0.01-0.2 μm and the polyolefin being preferably a linear low-density polyethylene. COPYRIGHT: (C)2006,JPO&NCIPI