MANUFACTURING METHOD OF CIRCUIT DEVICE

• Main Authors: ITO MASAMI, YAMAZAKI YASUHITO
• Format: Patent
• Language: English
• Published: 16.03.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit device particularly measuring electric characteristics of a built-in circuit element regarding manufacturing the circuit device provided with a plurality of circuit elements. SOLUTION: The method of manufacturing the circuit device is characterized in that a pattern for measurement of electric characteristics of the built-in circuit element 30 is formed, and by forming a pair of external electrodes thereon, the measurement after package is enabled, wherein the measuring pattern connecting the circuit element 30 and the external electrodes is not provided with a circuit elements etc., for changing the electric signal. The external electrodes are constituted of a first external electrode 37 for forming an electric circuit and a second external electrode 38 to be used only for measurement. By connecting the first electrode 37 and the second external probe 38 by a probe electrically, the electric characteristics of the built-in circuit element 30 are measured. COPYRIGHT: (C)2006,JPO&NCIPI