CMP PAD CONDITIONER

PROBLEM TO BE SOLVED: To provide a pad conditioner for a CMP (chemical mechanical polishing) device for use in machining a semiconductor substrate, which carries out stable and uniform pad removal while ensuring the flatness of a pad. SOLUTION: The pad conditioner for the CMP device is formed by bon...

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Bibliographic Details
Main Authors YAMAZAKI SHIGEKAZU, KADOMURA KAZUNORI, MORIBAYASHI HIDEO, MORITA KAZUKI, NAKAI MASANORI
Format Patent
LanguageEnglish
Published 02.03.2006
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a pad conditioner for a CMP (chemical mechanical polishing) device for use in machining a semiconductor substrate, which carries out stable and uniform pad removal while ensuring the flatness of a pad. SOLUTION: The pad conditioner for the CMP device is formed by bonding a single layer of diamond grains having a mean grain size of 5 to 1,000 μm, to a surface of a metal base, by nickel plating or a binder containing a brazing material as a main component. Specifically the pad conditioner is divided into a plurality of regions which are different in pad removing ability from each other, and super-abrasive grains are arranged at each intersection of straight lines constituting regular triangular mesh. Thus the number of abrasive grains is adjusted by varying the size of the mesh, i.e. the length of a side of a regular triangle, depending on the required pad removing ability of the conditioner. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040240274