SAW WIRE

PROBLEM TO BE SOLVED: To provide a saw wire having an excellent wire characteristic and allowing realizing of excellent slicing efficiency. SOLUTION: This saw wire has surface layer part residual stress RS up to a depth of 10 μm from an external surface located on a compression side, an absolute val...

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Bibliographic Details
Main Authors FUKUMURA MASAHITO, KUSUDA MASAHIRO
Format Patent
LanguageEnglish
Published 02.03.2006
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:PROBLEM TO BE SOLVED: To provide a saw wire having an excellent wire characteristic and allowing realizing of excellent slicing efficiency. SOLUTION: This saw wire has surface layer part residual stress RS up to a depth of 10 μm from an external surface located on a compression side, an absolute value ≥10 kg/mm2of the residual stress RS, and circumference 10 points average roughness PRz ≥0.3 μm measured along the circumference of cross section. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040238455