SOCKET FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To enable to reduce the occupied area of a socket main body on a printed-circuit board and to arrange the adjoining IC sockets more closely mutually in proximity so as to attain high density of mounting of the IC sockets. SOLUTION: The length of the arm of the pressing members...

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Bibliographic Details
Main Authors UJIIE AKIRA, SATO MASARU
Format Patent
LanguageEnglish
Published 23.02.2006
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:PROBLEM TO BE SOLVED: To enable to reduce the occupied area of a socket main body on a printed-circuit board and to arrange the adjoining IC sockets more closely mutually in proximity so as to attain high density of mounting of the IC sockets. SOLUTION: The length of the arm of the pressing members 26, 28 which are supported rotatably at the lower end of the arm part 30H of a cover member 30 is established corresponding to supporting of semiconductor devices 36, 42 having different outline dimensions, and is established smaller than the length of the arm part 30H such that a part of the pressing members 26, 28 may overhang toward outside through the recessed portion 20b of the socket main body 20. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20050257715