LIGHT EMITTING DIODE

PROBLEM TO BE SOLVED: To minimize a reflection cup to improve the luminance. SOLUTION: A reflection cup 2a is formed at the center of a circuit board 2 composing a package of a surface mount type LED1, and connection terminals 2d, 2g are arranged on the lower surface. Wiring circuits 2b, 2e arranged...

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Bibliographic Details
Main Authors SHIMURA TAKASHI, OKUWAKI DAISAKU
Format Patent
LanguageEnglish
Published 19.01.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To minimize a reflection cup to improve the luminance. SOLUTION: A reflection cup 2a is formed at the center of a circuit board 2 composing a package of a surface mount type LED1, and connection terminals 2d, 2g are arranged on the lower surface. Wiring circuits 2b, 2e arranged on the circuit board 2 are conducted to the connection terminals 2d, 2g via through holes 2c, 2f. The electrode of an LED element 3, bonded to the bottom surface of the reflection cup 2a and the wiring circuits 2b, 2e, are connected by a bonding wire 4. A fluorescent-material-included resin 5 with the fluorescent material dispersed is filled only in the reflection cup 2a and absorbs a part of light emission of the LED element 3 to convert its wavelength. A transparent resin 6 is adhered to the circuit board 2 as a whole, by covering the wiring circuits 2b, 2e, the bonding wire 4, and the fluorescent material containing resin 5. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040197480