CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP AND WIRING SUBSTRATE USED FOR IT

• Main Authors: DOKOCHI HISASHI, MATSUOKA HIROSHI, MIKAMI YOSHIKATSU, TSUKAGOSHI ISAO, HIROZAWA YUKIHISA
• Format: Patent
• Language: English
• Published: 12.01.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a connection structure to a wiring substrate of a semiconductor chip, which can obtain excellent connection reliability, even if thickness of the semiconductor chip is thin, and to provide the wiring substrate used for it. SOLUTION: The connection structure comprises a semiconductor chip 1 and a wiring substrate 4. A bump electrode 2 is provided in the semiconductor chip and/or the wiring substrate, and average roughness (JIS, B0601, ten point average roughness) of a surface in the bump electrode 2 is 0.5 μm or more. A dummy electrode 6 which has almost the same height as the bump electrode 2 is provided within a region surrounded by a peripheral part electrode of the semiconductor chip after connection. When a connection surface in the dummy electrode is projected, a plurality of apexes exist, whose shapes are either of triangle or "L", or these two sorts, or either of semi-circular or "C", or these two sorts, and moreover, these apexes are formed so as to be directed to a center part of the connection region. The connection structure of the semiconductor chip is formed by connecting the semiconductor chip having a thickness of 0.3 mm or less to the wiring substrate with an adhesive 11. COPYRIGHT: (C)2006,JPO&NCIPI