ADHESIVE RESIN MATERIAL FOR MOUNTING ELECTRONIC PARTS, ELECTRONIC DEVICE USING THE SAME, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide an adhesive resin material for mounting electronic parts with anisotropic conductivity, which can give an electronic device mounting electronic parts on a circuit board and excelling in reliabilty, and to provide the electronic device obtained by using it. SOLUTION:...

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Bibliographic Details
Main Authors NAKADA YASUKAZU, SATO AKINORI
Format Patent
LanguageEnglish
Published 12.01.2006
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide an adhesive resin material for mounting electronic parts with anisotropic conductivity, which can give an electronic device mounting electronic parts on a circuit board and excelling in reliabilty, and to provide the electronic device obtained by using it. SOLUTION: The adhesive resin material for mounting electronic parts comprises (A) a thermosetting resin, (B) 1-40 mass% of conductive particles having a mean particle diameter of 1-20 μm, (C) 0.01-10 mass% of light blocking fine particles whose mean particle diameter is in the range of 0.001-0.2 times that of the above component (B), and it has, in a cured film 25 μm thick, an average light transmittance of ≤10% in the wavelength region of 180-2,800 nm. The electronic device is formed by mounting the electronic parts on the circuit board using the above adhesive resin material. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040185305