SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, CIRCUIT BOARD, AND ELECTRONIC APPARATUS

• Main Author: AOYANAGI TETSUTOSHI
• Format: Patent
• Language: English
• Published: 08.12.2005
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To enhance the bonding strength of upper and lower interposers when a plurality of semiconductor chips are supported by the interposers. SOLUTION: The semiconductor device comprises a contact part 46 for connecting a first package 10, a second package 30, and first and second wiring patterns 14 and 34 electrically, and a reinforcing part 50. The first package 10 has a thermal expansion coefficient higher than that of the second package 30. The second package 30 is arranged so that a second interposer 32 overlaps a first semiconductor chip 16 and a first interposer 12. The contact part 46 is provided between the first and the second interposers 12 and 32 so that a first end is connected with the first wiring pattern 14 and a second end is connected with the second wiring pattern 34. The reinforcing part 50 is provided while exposing a part of the contact part 46 and covering the circumference of the first end of the contact part 46. COPYRIGHT: (C)2006,JPO&NCIPI