DOUBLE-SIDE POLISHING DEVICE

PROBLEM TO BE SOLVED: To make flatness of an upper polishing plate highly accurate by eliminating generation of waving deformation in a circumference direction of the upper surface plate. SOLUTION: This double-side polishing device polishes both sides of a workpiece 6 by rotating a lower polishing p...

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Bibliographic Details
Main Authors IIHAMA TAKAO, OINUMA KEIICHI
Format Patent
LanguageEnglish
Published 02.12.2005
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To make flatness of an upper polishing plate highly accurate by eliminating generation of waving deformation in a circumference direction of the upper surface plate. SOLUTION: This double-side polishing device polishes both sides of a workpiece 6 by rotating a lower polishing plate 14 and the upper polishing plate 4 provided with an upper side polishing tool 5 facing the lower polishing plate 14 in a state for relatively rotating a sun gear 9 holding the workpiece 6 in a plurality of holding holes of a plurality of carriers 7 arranged on the lower polishing plate 14 provided with a lower side polishing tool 15 and engaged with each of the carriers 7 and an internal gear 8 arranged at the outside of the sun gear 9 and engaged with each of the carriers 7. An upper polishing plate driving shaft 1 for rotating the polishing surface plate 4 is directly connected to the upper polishing plate 4. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040150996