PRINTED CIRCUIT BOARD AND ITS MANUFACTURIG METHOD

PROBLEM TO BE SOLVED: To porovide a printed circuit board capable of preventing a corrosion of a metallic foil which forms an external connection terminal and enhancing an reliability of an electrical connection, and to provide its manufacturing method. SOLUTION: The side surface of the metallic foi...

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Bibliographic Details
Main Authors UEHARA MASATO, SAITO MICHIFUMI
Format Patent
LanguageEnglish
Published 24.11.2005
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To porovide a printed circuit board capable of preventing a corrosion of a metallic foil which forms an external connection terminal and enhancing an reliability of an electrical connection, and to provide its manufacturing method. SOLUTION: The side surface of the metallic foil 5 comprising the external connection terminal 6 with a pattern formed in the predetermined shape is covered by an anisotropic conductive resin material 8 arranged in a non-arranged region of the mettalic foil 5 in the region on an insulating board 1 with the external connection terminal 6 formed. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040145159