POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN AND ELECTRONIC COMPONENT USING SAME

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition developable with an alkali and having excellent transmittance for rays in the i-line region from a mercury lamp, preferable sensitivity, excellent developing property and preferable resolution. SOLUTION: The positive photos...

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Bibliographic Details
Main Authors ANDO SHINJI, UEDA MITSURU, MINEGISHI TOMONORI, TOYOKAWA IKUHIRO, IWASHITA KENICHI
Format Patent
LanguageEnglish
Published 17.11.2005
Edition7
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition developable with an alkali and having excellent transmittance for rays in the i-line region from a mercury lamp, preferable sensitivity, excellent developing property and preferable resolution. SOLUTION: The positive photosensitive resin composition comprises at least a polybenzoxazole precursor having a structure of inhibiting an intramolecular hydrogen bond in a part of the open-ring structure which constitutes an oxazole ring by cyclizing of the polybenzoxazole precursor, and a compound which generates an acid by irradiation with radiation. The positive photosensitive resin composition is used to manufacture a pattern. COPYRIGHT: (C)2006,JPO&NCIPI
Bibliography:Application Number: JP20040137584